德国纽伦堡国际微电子系统集成、集成电路展览会（SMTconnect / SMT Hybrid Packaging）是国际微电子集成电路最专业的展览会，是欧洲同类最大的展会，一年一届，在纽伦堡国际展览中心举行，该展也称电子贴片混合包装展，SMT Hybrid Packaging展是欧洲最大的微电子系统集成的贸易展览会，与该展同时举行的国际电子电路会议（Electronic Circuits World Convention ECWC）成立于1978年，研讨电子电路的发展方向。展会积聚了行业领先的公司，提供了理想平台，展示最新的趋势和发展，以及最新解决方案。除此以外，每年展会上还提出的最新发展趋势和相关技术改进等，以及保持在最新的解决方案等。参展商中超过33%的公司来自德国外，该展会不仅提供广泛的，也是具有国际领先水平。
SMT混合包装展是欧洲唯一一个从微电子系统集成的全面视角，从最初的理念和发展到生产电子组件制造过程中的所有技术过程。SMT Hybrid Packaging展的参展企业或观众也可以受益于展会现场各种行之有效的活动取得的成功，来自多个国家的专业观众非常积极的评论高质量的展览。该展会从设计、开发到PCB生产、元器件、包装和测试系统-贴片/混合/包装提供了一条龙生产下的所有产品和相关技术介绍。
SMT Hybrid Packaging 展是世界上最完整的系统集成微电子展览活动，是在该领域的电子制造业提供最新的产品，服务和解决方案的国际会议。从电子组件、印刷电路板、焊接试验等完成市场概述集中在一起共同展示与讨论。展览主题：组件、组成部分、设计和开发、环境管理体系、印制板生产、包装材料、丝网印刷、焊接、测试系统等。
展品范围(Show Products):
电脑辅助教育，化工元素，电子包装，混合电路，插入设备，联接设备，测量器材，测量系统，印刷电路板，印刷电路板生产，屏幕打印，半导体生产，焊接设备，表面处理技术，测试器材，测试技术，电子电路工具。
展会报告(Show Reports):
Stuttgart, Germany, 13 June 2024. In addition to products and solutions from 165 exhibitors, the focus at the SMTconnect 2024 in Nuremberg, Germany, from 11 – 13 June 2024 was primarily on personal exchange on current trends and developments in electronics manufacturing.
Over three days, the trade fair for electronics production brought together experts in assembly and connection technology on a total of 15,000 square meters in the exhibition halls. The trade fair created space for personal exchange within the SMTconnect community. More than 7,100 visitors were able to network intensively within the industry and expand their specialist knowledge even further as part of a top-class lecture program. Diverse highlights: Forum program, production line and much more
The trade fair forum provided exciting insights into current topics affecting the industry, including AI in electronics production, Industry 4.0 and manufacturing of power electronics. The lectures best attended included the keynote “Innovative packaging and connection technology in power electronics - insight into research”, by Nils Thielen, Head of Electronics Production Research at Friedrich-Alexander-Universität Erlangen-Nürnberg as well as the lecture "New application for lasers in electronics production - lasering cables onto printed circuit boards" by Uwe Kriegshäuser, Managing Director of Schnaidt GmbH.
This year, the Fraunhofer Institute for Reliability and Microintegration (IZM) “Future Packaging” production line was shown under the motto “See the REAL DEAL”. Various live production demonstrations examined how a higher degree of digitalization and automation can make production processes more robust against disruptions and external influences. With this joint effort by 15 participating companies, trade visitors benefitted from a large pool of expertise. Those interested were able to find suitable contacts and could pose questions on specific challenges. This exchange of knowledge was considered the first building block to make possible recommendations for action.
This year interested visitors were able to find all the elements required for the production process in system integration. The SMTconnect presented a comprehensive spectrum of surface mounting, from materials and components to coating and test systems.
SMTconnect 2025: 6 – 8.5.2025
